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  1. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
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    Nxgen San Diego1

    www.dodgedemonclub.com - 2009-04-03

  2. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
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    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

land grid array1 fine pitch bga1 csp1 die stacking1 bga1 chip scale package1 ball grid array1 for sale4 abr2 fold-over1 fbga1

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